GM.WS Series
The GM.WS series X-ray orientation units are specifically dedicated to the accurate orientation of small to large size ingots before cutting on a wire saw. The proposed equipment and method call for a strictly crystallographic and mathematical process which takes the initial crystal disorientation* into account. By using this equipment, the ingot orientation is measured in such a way that the ingot can remain horizontal on the wire saw work holder for further slicing process, taking both the ingot own disorientation resulting from crystal pulling and OD grinding and a specified "off-orientation" if any, into consideration. In other words the equipment automatically targets the resulting angle at which the ingot can be sliced without requiring a vertical tilting.
Depending of the type of wire saw, several gluing possibilities can be applied. Dedicated gluing equipment with orientation control is available.
* Process development with the scientific assistance of Mr Georges Bravic, at the Crystallography Research Laboratory of the University of Bordeaux, France.
GM.SI Series
The GM.SI Series X-ray orientation systems are heavy duty production units especially designed for locating the flat or notch position on all kinds of single crystals, from the smallest to the largest size. All single crystal can be processed, for all applications such as semiconductors, opto-electronics, optics, etc.